Machine Vision Inspection Systems
ViTrox provides Total Machine Vision Solutions for semiconductor IC inspection. Our products include Mark, Lead & Package defects inspection systems for MLP, QFP, BGA, SOT, SC70, etc. We provide customized solutions for true 3D Lead Inspection, sub-pixel accuracy measurement systems, 4-in-1 integrated and high-speed on-the-fly vision systems. Our solutions are guaranteed to be cost-effective, innovative and installed worldwide by major semiconductor manufacturers.
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•Inspects dimensional and cosmetic defects of bottom and side view of pad and package units over a wide range of package sizes
•SD TOOL allows intelligent inspection of detects by using a differential
function and enables smart and quick detection of selected defects.
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•For checking on packages in the range of 2-6mm and 3-7mm without the hassle of changing conversion kits .
•Smart Corner Tool enables automatic detection of package corners which accelerates the whole process of set up.
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•For highest accuracy defects detection without conversion.
•Smart detection of defects by WiSS technology enables detection of defects down to 3mils x 3 mils
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